Prof. Lajos Hanzo

Affiliation: Chair of Telecommunications, Head of Next-Generation Wireless, FREng, FIEEE, FIET, Fellow of EURASIP

University of Southampton, UK

Biography: Prof. Lajos Hanzo is a Fellow of the Royal Academy of Engineering (FREng), FIEEE, FIET and a EURASIP Fellow, Foreign Member of the Hungarian Academy of Science. He holds honorary Doctorates from the University of Edinburgh and the Technical University of Budapest. He co-authored 19 IEEE Press - John Wiley books andpublished 2000+ research contributions at IEEE Xplore. Prof. Hanzo has helped the fast-track career of 123 PhD students. Over 40 of them are Professors at various stages of their careers in academia and many of them are leading scientists in the wireless industry.

For further information on his research in progress and associated publications please refer to IEEE Xplore.



Abstract: Thanks to the spectacular advances in signal processing and nano-technology, five wireless generations have been conceived over the past five decades. Whilst the 5G systems are being rolled out, the momentum of developing the 6G systems is growing and there is an ongoing debate as to what the next ’killer-application’ is likely to be - could it be joint sensing, communications and computing?

• Joint Radar and Communication Design: Applications, State-of-the-Art, and the Road Ahead” IEEE TCOM, by Fan Liu, Christos Masouros, Athina P. Petropulu, Hugh Griffiths & Lajos Hanzo

• Social Networking and Caching Aided Collaborative Computing for the Internet of Things by Yutong Ai, Li Wang, Zhu Han, Ping Zhang & Lajos Hanzo

• Bridging the Social and Wireless Networking Divide: Information Dissemination in Integrated Cellular and Opportunistic Networks by Jie Hu, Lie-Liang Yang, Vincent Poor & Lajos Hanzo IEEE Access, 2015 • Beamforming Design Based on Two-Stage Stochastic Optimization for RIS-Assisted Over-the-Air Computation Systems Xiongfei Zhai, Guojun Han, Yunlong Cai & Lajos Hanzo IEEE IoT Journal This overview will highlight some of the associated design options and challenges, complemented by potential application scenarios.